![]() Leveraging its experience in producing innovative IoT solutions, AAEON has announced the newest addition to its IoT Gateway product line with the launch of the Just place the rubber stopper in a different gear to adjust the flex of the inner assembly, and experience keyboard flex with different levels of softness and hardness. Benefiting from the advantages of the Alice keyboard layout, AM AFA has built-in three-stage leaf-spring with adjustable gears. Coilovers allow for stiffness and range adjustment of the car's suspension, and Angry Miao's three-stage adjustable leaf-spring mount brings a similar experience to keyboards. The design of the AM AFA's adjustable leaf-spring mount takes its inspiration from height adjustable coilover suspension seen on cars since the 1950s. After 2 hours of manual grinding and sandblasting of each single piece, AM AFA receives its body finish through anodizing, electrophoresis, or baked paint. Its smooth edges are carefully cut and polished. Hollowing out the metal frame of AM AFA takes over 7 hours and is done using high-precision 5-axis CNC machinery. Like a fighter jet, AM AFA excels in next-level design, mounting system, and craftsmanship. AM AFA takes its inspiration from one of the Angry Miao team's favorite mecha animes with its fighter jet-like forward-swept design. At the same time, Angry Miao announced the Hover Ergonomic Maglev Wrist Rest, provided as a free gift with all AM AFA purchases. On November 1, 2022, Angry Miao officially launched AM AFA, the world's first mechanical Alice keyboard with 3-stage adjustable leaf-spring mount for 18 different typing combos. Additionally, as the upstream enablement of RISC-V has started within the Android Open Source Project, (AOSP), designers will have unrivaled choice and flexibility as they consider the positive implications with that platform for future designs." "We have optimized these new RISC-V Vector enabled products to deliver the performance and efficiency improvements the industry has long been asking for, and we are in evaluations with a number of top-tier customers. These new products offer powerful performance and compute density for companies looking to upgrade from legacy ISAs," said Chris Jones, SiFive VP of Product. "The P670 and P470 are specifically designed for, and capable of handling the most demanding workloads for wearables and other advanced consumer applications. The modern and innovative SiFive design methodologies bring raw compute density that is a substantial advantage for SiFive Performance products and also translates into significant cost savings for customers. The SiFive Performance P670 and P470 RISC-V processors bring unparalleled compute performance and efficiency that is significantly raising the bar for innovative designs in these high-volume markets. the founder and leader of RISC-V computing, today announced two new products that address the need for high performance and efficiency in a small size in high volume applications like wearables, smart home, industrial automation, AR/VR, and other consumer devices. "In delivering the world's most advanced DRAM technology with more bits per memory wafer than ever before, this node lays the foundation to usher in a new generation of data-rich, intelligent and energy-efficient technologies from the edge to the cloud." "The launch of our 1-beta DRAM signals yet another leap forward for memory innovation, brought to life by our proprietary multi-patterning lithography in combination with leading-edge process technology and advanced materials capabilities," said Scott DeBoer, executive vice president of technology and products at Micron. The node delivers around a 15% power efficiency improvement and more than a 35% bit density improvement with a 16Gb per die capacity. The world's most advanced DRAM process node, 1β represents an advancement of the company's market leadership cemented with the volume shipment of 1α (1-alpha) in 2021. Beyond mobile, 1β delivers the low-latency, low-power, high-performance DRAM that is essential to support highly responsive applications, real-time services, personalization and contextualization of experiences, from intelligent vehicles to data centers. The node delivers significant gains across performance, bit density and power efficiency that will have sweeping market benefits. The company is debuting its next generation of process technology on its low-power double data rate 5X (LPDDR5X) mobile memory, delivering top speed grades of 8.5 gigabits (Gb) per second. Micron Technology, Inc., announced today that it is shipping qualification samples of its 1β (1-beta) DRAM technology to select smartphone manufacturers and chipset partners and has achieved mass production readiness with the world's most advanced DRAM technology node.
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